Universal-300 polishing machines are fully automatic and apply chemical mechanical polishing. They feature a process of dry in and dry out. They are mainly applied to 8″-12″ wafers and can be used in integrated circuit manufacturing, wafer substrate production, polishing material R&D and polishing process exploration. They were officially delivered to SMIC, which is China's biggest integrated circuit wafer original equipment manufacturer (OEM), in August 2015. The machines will produce 3,000 wafers every month after debugging. They are the first Chinese 12-inch chemical-mechanical polishing machines to enter large-scale production, which is a milestone in domestic production of high-end equipment.