Tsinghua Unigroup, which specializes in integrated circuit design and manufacturing and is one of Tsinghua Holdings Co Ltd’s major subsidiaries, will work with Chengdu, capital city of Sichuan province, to invest a total of 200 million yuan ($28 million) in constructing an integrated circuit (IC) ecosystem, focusing on IC manufacturing, research and development, and design. 

The signing ceremony between Tsinghua Unigroup and Chengdu municipal government on Dec 12.

The world's third largest mobile chip manufacturer inked a strategic agreement with Chengdu on Dec 12.

Tsinghua Unigroup’s subsidiary company New H3C Group, a world-leading provider of New IT solutions, also established partnership with Chengdu by signing an agreement on the same day. They will work on research & development and integrated applications of new generation information technology, including cloud computing, big data, connections, and safety.

New H3C Group and Chengdu’s High-tech Development Zone agreed that the New H3C Group will settle its cloud computing head office in the zone, cover all cloud computing businesses, build an institute, and train its personnel.

Wang Dongming (R), Secretary of Sichuan Provincial Party Committee, meets with Zhao Weiguo (L), chairman of Tsinghua Unigroup before the signing ceremony.

This move is expected to help upgrade Chengdu’s chip and cloud business to a larger and higher level and lift the city’s influence in integrated circuit and cloud computing.