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Tsinghua Unigroup ranks in the top 20 of 2019 semiconductor technology invention patents list, says incoPat


Tsinghua Unigroup, subsidiary of Tsinghua Holdings, has been ranked 20th in the 2019 Global Semiconductor Technology Invention Patent Ranking List. The list was jointly issued by the incoPat Innovation Index Research Center - a leading patent information platform in China - and IPRdaily Chinese website, on November 19. Tsinghua Unigroup ranked the highest in the electrical semiconductor field among enterprises on the Chinese mainland.

The list was put together based on statistical analysis of the application numbers of patents for invention in semiconductor technology that were published globally from Jan 1 to Oct 31, 2019.

After years of development, Tsinghua Unigroup has now established its production industry chain ranging from chip design, manufacturing, packaging and testing to networking, storage, cloud computing, and big data. It has made continuous efforts to broaden the layout of patents and has formed a complete intellectual property system.

To date, Tsinghua Unigroup has established 60 R&D centers around the world with about 30,000 patents, more than 90 percent of which are invention patents. It has also won many national science and technology awards, including the special prize of the National Science and Technology Progress Award.

In the field of cloud networks, as of the end of October 2019, New H3C Group, a subsidiary of Tsinghua Unigroup, had submitted 10,535 patent applications, with invention patent applications accounting for 90 percent of these. In 2018 alone, New H3C Group filed 1,352 patent applications.

With regard to chips, Tsinghua Unigroup's UNISOC ranks first in China and third in the world in the design of mobile phone chips for the open market. In 2019, UNISOC won the silver medal in the 21st China Patent Award.

This year, Yangtze Memory Technologies, also a subsidiary of Tsinghua Unigroup, announced it would apply Xtacking® 2.0 in its third-generation 3D NAND flash. UNISOC launched its 5G baseband chips and the 5G communication technology platform, and completed the design and development of 5G millimeter-wave terminal prototypes.

In addition, Tsinghua Unigroup's subsidiary Guoxin Micro has China's first high-performance FPGA with independent property rights, and the company's THD89 is one of the dual interface smart card security chips with the world's highest security level certification. The Xi'an UniIC Semiconductors, a subsidiary of Tsinghua Unigroup, has developed the world's first commercial embedded self-correcting DRAM product.