First domestically produced 12-inch ultra-precision wafer thinning machine is officially launched by Hwatsing. [Photo/Wechat account qinghuachanye]

Tianjin Hwatsing Technology Co., Ltd., as one of the core enterprises in China's integrated circuit equipment industry, launched its first 12-inch ultra-precision wafer thinning machine (Versatile-GP300) with independent intellectual property rights and sent it to a leading domestic integrated circuit company on Sept 29.

Versatile-GP300 [Photo/Wechat account qinghuachanye]

The Versatile-GP300 has broken China's bottleneck in packaging technology and 3D IC chip production.

The Versatile-GP300 includes the core technologies of ultra-precision grinding of wafer backsides, intelligent control of flatness, surface damage and defect control.  The product will be used in 3D IC manufacturing, advanced packaging and other large-scale chip manufacturing production lines to meet the needs of ultra-precision thinning of 12-inch wafers.

It will be applied to the packaging of advanced technology chips and the design and production of 3D ICs.